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嘉澜高电子科技来介绍下PCBA常见英语术语解释。
PCBA加工常涉及一些英语术语,格亚信PCBA加工介绍一些常用的PCBA术语 ,便于更详细了解PCBA加工详细事项,由于相关术语较多,如需查阅相关术语,请在键盘上按 Ctrl + F 查询。
板面凹痕
dent
内层白斑
I/L white spot
线路缺口
circuit nick
蚀刻不净
under etching
绿油剥离
S/M peel off
显影不净
under developing
基材白点
laminate measling
铜面氧化
copper oxide
绿油上焊盘
s/m on pad
白字上焊盘
c/m on pad
阻焊不良
poor S/M
线路擦花
track scratch
锡上线
sn on circuit
聚锡
sn mass
锡灰
sn gray
焊盘露铜
cu exposed on pad
锡上金手指
sn on G/F
金手指凹痕
G/F dent
金手指擦花
G/F scratch
金手指粗糙
G/F roughness
v-cut 不良
poor V-cut
倒边不良
poor milling
针床压伤
ET dent
拖锡不良
poor touch up
补金不良
poor repairing Au
补油不良
poor repairing s/m
针孔
pinhole
胶渍
paster stain
孔内毛刺
burrs in hole
锡珠入孔
solder in hole
露铜
expose Cu
露镍
expose Ni
绿油起泡
solder mask blister
绿油起皱
solder mask wrinkles
金手指氧化
G/F oxiding
金颜色不良
Au discoloration
金面凸起
Au surface blister
绿油入孔
solder mask in hole
爆板
board angle damage
翘板
warp
漏印字符
skip
金粗
Au too big
金簿
Au too thin
金手指缺口
G/F voids/nick on G/F
金手指发黑
G/F too black
字符印反
inverse C/M
金手指针孔
G/F pinholes
标志不清
symbol unclear
标志错
symbol wrong
绿油鬼影
ghost in S/M
手指印
finger print
补线不良
poor line repairing
锡高
excessive solder
孔小
hole undersize
字符错
wrong C/M
字符印偏
C/M misalignment
字符入孔
C/M in hole
字符重影
C/M double image
漏镀金手指
missing plating G/F
金手指发白
G/F gray
焊盘脱落
pad break off/pad peel off
焊盘露铜
pad expose cu
断绿油桥
missing S/M bridge
塞孔
block hole
水迹
water print
锡珠
solder ball
砂孔
pitting
聚油
excess solder mask
锡粗
Sn too thick
线路上锡
Sn overlap scratch
绿油下杂物
contamination under S/M (Foreign material under S/M)
焊盘损坏
(Pad)land damage
焊盘翘起
lifted (Pad)land
偏位
misregistration
漏钻孔
missing hole
焊盘缺口
nick on pad
线路缺口
nick on track
开路
open circuit
短路
short circuit
线路狗牙
circuit wist
线路缺口
circuit nick
线路凹痕
circuit dent
渗镀
plating bleeding
焊盘缺口
pad nick
内层白斑
I/L white spot
黑化不良
poor B.O
爆板
delamination
粉红圈
pinking ring
层压起泡
press blister
错位
misregistation
偏位
shift
孔内无铜
no Cu on PTH (PTH Void)
孔内毛刺
hole burrs
NPTH 有铜
Cu on NPTH
铜面露基材
exposed laminate
铜面凹痕
dent on Cu surface
胶渍
gum stain
夹膜
D/F nip
蚀刻不尽
under etching
线幼
line too thin
孔大
hole oversize
孔小
hole undersize
偏孔
hole misregistration
铜面瘤粒
Cu nodule
显影不尽
under developing
铜面刮伤
scratch on Cu surface
塞孔
hole plugged
修理不良
poor repairing
铜薄
copper too thin
内层擦花
I/L scratch
内层偏位
I/L misregistation
内层杂物
I/L inclusions
掉膜
D/F peel off
干膜碎
D/F residual
退锡不尽
poor Sn stripping
间隙小
space too narrow
板薄
board too thin
板厚
board too thickness
针孔
pinhole
崩孔
breakout
侧蚀
undercut
镀层粗糙
plating layer roughness
亚色
dull colour
焊盘翘起
lifted (Pad)land
漏钻孔
missing hole
露布纹
weave exposure
钻偏孔
hole misregistratiion
孔损害
hole damage
基材分层
delamination
蚀刻过度
over etching
多孔
hole too many
残铜
remain Cu
孔内露基材
laminate exposure in hole
焊盘脱落
pad break off (peel off)
焊盘凹痕
pad dent
焊盘凸起
pad bulge
焊盘损坏
pad damaged
焊盘缺口
pad nick
焊盘露铜
pad expose Cu
内层开路
Inner open
内层短路
Inner short
外层开路
Outer open
外层短路
Outer short
内层蚀刻过度 Inner over etching
外层蚀刻过度 Outer over etching
内层树脂气泡 Resin void
内层杂物
Foreign material
内层图形移位 Inner pattern mis-registration
层与层移位
Layer to layer mis-registration
打孔不良
Improper targeting
内层蚀刻不净 Inner under etching
露布纹
Weave texture/exposure
擦花(氧化膜面)
Scratch(Oxide surface)
板损坏
Damaged board
分层(物料)
Delamination (Raw material)
内层不配套
Excessive inner core
(mismatch inner layer cores)
板过厚
Over thickness
白点(压板)
Measling (Pressing)
白点(喷锡)
Measling (HASL)
板曲
Warpage
板焦黄
Burnt
起皱
Wrinkle
起泡(压板)
Blistering (Pressing)
镀层起泡
Blistering (Cu plating)
喷锡起泡
Blistering (HASL)
板面凹痕
DENT (Pressing profiling G/F)
白斑
Crazing
胶渣
Gum residue
孔未穿
Incomplete drilling
披锋
Burr
多孔
Extra hole
偏孔
Hole shift
孔径大
Hole oversize
孔径小
Hole undersize
少孔
Missing Hole
塞孔
Block hole
崩孔
Hole breakout
孔粗糙(镀铜)
Hole roughness(Cu plating)
孔粗糙机械钻孔)
Hole roughness(Mechanical drill)
崩线、线路缺口 Nick
/
void on trace
缺口
Nick
/
void on pad
曝光过度
Over-exposure
曝光不良
Under exposure
显影不足
Under develop
干膜脱落
D/F Peel off
干膜碎
D/F Residue/Residual
干膜移位
D/F Mis-registration
标志不清(曝光)
Illegible marking (exposure)
错菲林
Wrong A/W
非镀铜孔有铜 Copper in NPTH
镀铜孔内无铜 No copper in PTH
渗镀
Nickel smear
电镀粗糙
Rough plating
孔壁缺口
Hole void (Cu)
金手指颜色不良 Gold Finger discoloration
金面颜色不良 Gold discoloration
金面阴阳色
Two tone colour on gold surface
铜、镍脱落
Copper/Nickel peel off
铜镀厚度超要求 Copper thickness out of requirement
漏镀(金手指等)
Skip plating(G/F ENIG Cu)
金面污点
Stain on gold surface
电镀针孔
Plating pits (Cu) (Plating Pinholes)
镀锡缺点
Tin plating defect
铜碎
Copper residue
黑孔
Black Hole
镀层白渍
Plating haze
金手指凸出
Protrusion (G/F)
板污
Board contamination
手指套印
Glove mark
褪锡不良
Improper Tin stripping
微短路
Micro short
粉红圈
Pink ring
焊盘崩缺
Broken annular ring
(Broken Pad)
蚀刻不净
Under etching
焊盘脱落
Pad peel off
绿油上焊盘
S/M on pad
绿油图形移位
Pattern mis-registration
绿油露线
Expose trace
油薄
Uneven S/M thickness
入孔
S/M in hole
绿油冲板不良
S/M under develop
漏塞孔
S/M unplugged
IC 栏不良
Poor IC barrier
绿油脱落
S/M peel off
塞孔不满
Incomplete S/M plugging
多开绿油窗
Extra opening
溶剂测试失败
Fail in solvent test
漏印
Skip printing
水印
Water mark (stain)
断绿油桥
S/M Bridge broken
绿油下氧化
Oxidation under solder mask
返工不良
Poor rework
错油
Wrong Ink
漏印字符
Missing legend ink
字符入孔
Legend in Hole
字符脱落
Legend peel off
字符上焊盘
Legend on pad
字符不清
Illegible legend
日期不清
Illegible date code
锣坑次品
Milling (Routing) Defects
啤板方向错
Wrong punch direction
漏锣
Missing routing
漏斜切
Missing chamfering
斜边过度
Over chamfefing
错外形尺寸
Wrong outline dimension
倒边不良
Bevelling defect
金手指脱落
Gold finger peel off
露镍、铜
Ni/Cu exposure
缺口
Nick (G/F)
涂层不良
Poor ENTEK
锡上金手指
Solder on G/F
上锡不良
Dewetting
不上锡
Non wetting
锡珠、锡堆
Solder ball/lump
锡上线
Solder on trace
针痕
Pin mark
阻抗超出要求
Impedance out of requirement
工程试验
Engineering Evaluation
微切片
Microsection
以上就是嘉澜高电子科技介绍的PCBA常见英语术语解释内容。